{"id":3687,"date":"2026-10-18T09:33:59","date_gmt":"2026-10-18T13:33:59","guid":{"rendered":"https:\/\/canasanta.ca\/uncategorized\/samsung-tsmc-nvidia-memoria-hbm-3-nanometros\/"},"modified":"2026-10-18T09:33:59","modified_gmt":"2026-10-18T13:33:59","slug":"samsung-tsmc-nvidia-memoria-hbm-3-nanometros","status":"publish","type":"post","link":"https:\/\/canasanta.ca\/en\/ciencia\/tecnologia\/samsung-tsmc-nvidia-memoria-hbm-3-nanometros\/","title":{"rendered":"Samsung recurrir\u00e1 a TSMC para los chips de memoria que alimentar\u00e1n la pr\u00f3xima generaci\u00f3n de Nvidia"},"content":{"rendered":"

Una alianza que hasta hace poco habr\u00eda parecido improbable empieza a tomar forma en el coraz\u00f3n de la carrera mundial por los semiconductores. Samsung Electronics utilizar\u00e1 el proceso de fabricaci\u00f3n de 3 nan\u00f3metros de TSMC para producir componentes destinados a la pr\u00f3xima generaci\u00f3n de memorias de alto ancho de banda de Nvidia, seg\u00fan inform\u00f3 este 18 de octubre el Seoul Economic Daily y recogi\u00f3 Reuters. El movimiento unir\u00eda, en una misma cadena tecnol\u00f3gica, a tres de los nombres m\u00e1s decisivos de la infraestructura que sostiene el actual auge de la computaci\u00f3n avanzada.<\/h3>\n

 <\/p>\n\n\n\n

Samsung mira hacia su gran rival<\/strong><\/h2>\n\n\n\n

Seg\u00fan el reporte, Samsung recurrir\u00e1 al proceso de 3 nan\u00f3metros de Taiwan Semiconductor Manufacturing Company para fabricar los llamados base dies de chips HBM personalizados de pr\u00f3xima generaci\u00f3n para Nvidia. De concretarse en esos t\u00e9rminos, ser\u00eda la primera vez que Samsung trabaja con la compa\u00f1\u00eda taiwanesa durante esta etapa de fabricaci\u00f3n de HBM.<\/p>\n\n\n\n

El dato es significativo porque Samsung no es simplemente un comprador de tecnolog\u00eda: es uno de los mayores fabricantes de semiconductores del planeta y compite directamente con TSMC en servicios avanzados de fundici\u00f3n. Que una parte cr\u00edtica del proceso pueda apoyarse en tecnolog\u00eda de su rival muestra hasta qu\u00e9 punto la presi\u00f3n por producir componentes capaces de alimentar los sistemas de Nvidia est\u00e1 reordenando relaciones industriales que durante a\u00f1os parec\u00edan mucho m\u00e1s r\u00edgidas.<\/p>\n

 <\/p>\n\n\n\n

HBM: la memoria que se volvi\u00f3 estrat\u00e9gica<\/strong><\/h2>\n\n\n\n

Las memorias HBM \u2014High Bandwidth Memory\u2014 est\u00e1n dise\u00f1adas para mover enormes cantidades de informaci\u00f3n a gran velocidad entre memoria y procesadores. Su arquitectura apilada permite concentrar ancho de banda en un espacio reducido y se ha convertido en una pieza fundamental de aceleradores utilizados en centros de datos y cargas de c\u00f3mputo de alto rendimiento.<\/p>\n\n\n\n

La demanda de estos componentes ha aumentado a medida que Nvidia y otros dise\u00f1adores de procesadores buscan sistemas cada vez m\u00e1s potentes. En ese contexto, el rendimiento, la eficiencia energ\u00e9tica y la capacidad de fabricar a escala son tan importantes como el propio dise\u00f1o del chip. El proceso de 3 nan\u00f3metros de TSMC coloca la noticia precisamente en ese punto: no se trata solo de memoria, sino de c\u00f3mo integrar y fabricar los componentes que acompa\u00f1ar\u00e1n a una nueva generaci\u00f3n de hardware.<\/p>\n

 <\/p>\n\n\n\n

Tres gigantes dentro del mismo circuito<\/strong><\/h2>\n\n\n\n

La operaci\u00f3n dibuja una configuraci\u00f3n industrial poco habitual. Nvidia domina buena parte del mercado de aceleradores de c\u00f3mputo avanzado; TSMC se ha convertido en el fabricante por contrato m\u00e1s importante de chips de vanguardia; y Samsung mantiene una enorme presencia tanto en memoria como en fabricaci\u00f3n de semiconductores.<\/p>\n\n\n\n

Reuters atribuye la informaci\u00f3n al Seoul Economic Daily, por lo que todav\u00eda conviene distinguir el reporte period\u00edstico de un anuncio corporativo conjunto de las tres compa\u00f1\u00edas. Pero, si el esquema se confirma plenamente, la decisi\u00f3n mostrar\u00eda c\u00f3mo las necesidades de la pr\u00f3xima generaci\u00f3n de hardware est\u00e1n obligando incluso a competidores directos a combinar capacidades.<\/p>\n

 <\/p>\n\n\n\n

La batalla ya no se libra en un solo chip<\/strong><\/h2>\n\n\n\n

Durante a\u00f1os, la conversaci\u00f3n sobre semiconductores se concentr\u00f3 en qui\u00e9n pod\u00eda fabricar el transistor m\u00e1s peque\u00f1o o el procesador m\u00e1s r\u00e1pido. El mercado actual es m\u00e1s complejo. El cuello de botella puede aparecer en la memoria, en el empaquetado, en la capacidad de producci\u00f3n o en la integraci\u00f3n de m\u00faltiples componentes dentro de un mismo sistema.<\/p>\n\n\n\n

Por eso esta posible colaboraci\u00f3n resulta m\u00e1s reveladora de lo que parece. Samsung, TSMC y Nvidia representan tres piezas distintas de una misma maquinaria tecnol\u00f3gica. Que sus caminos converjan alrededor de la pr\u00f3xima generaci\u00f3n de HBM es una se\u00f1al de cu\u00e1nto ha cambiado la industria: en la carrera por construir computadoras cada vez m\u00e1s poderosas, incluso los rivales pueden terminar fabricando juntos el mismo futuro.<\/p>","protected":false},"excerpt":{"rendered":"

Samsung utilizar\u00e1 por primera vez tecnolog\u00eda de fabricaci\u00f3n de TSMC en la etapa HBM para chips de memoria de pr\u00f3xima generaci\u00f3n destinados a Nvidia, seg\u00fan un reporte citado por Reuters.<\/p>","protected":false},"author":284226809,"featured_media":3686,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_wpcom_ai_launchpad_first_post":false,"_jetpack_hide_featured_image":false,"_jetpack_featured_image_duplicate_dismissed":0,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":true,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2},"jetpack_post_was_ever_published":false},"categories":[33205457,33205424],"tags":[33206981,33205924,33206979,33206980],"class_list":["post-3687","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-al-dia","category-tecnologia","tag-hbm","tag-nvidia","tag-samsung","tag-tsmc"],"acf":{"introduccion":"","fuentes_y_referencias":"Reuters, 18 de octubre de 2026 \u2014 Samsung to use TSMC technology for Nvidia\u2019s next-generation memory chips, Seoul newspaper reports. https:\/\/www.reuters.com\/world\/asia-pacific\/samsung-use-tsmc-technology-nvidias-next-generation-memory-chips-seoul-newspaper-2026-10-18\/","autor":748},"yoast_head":"\nSamsung recurrir\u00e1 a TSMC para los chips de memoria que alimentar\u00e1n la pr\u00f3xima generaci\u00f3n de Nvidia - Ca\u00f1asanta<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/canasanta.ca\/en\/uncategorized\/samsung-tsmc-nvidia-memoria-hbm-3-nanometros\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Samsung recurrir\u00e1 a TSMC para los chips de memoria que alimentar\u00e1n la pr\u00f3xima generaci\u00f3n de Nvidia\" \/>\n<meta property=\"og:description\" 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